SEMICONDUCTORS
Differentiated technology allowing for faster and more efficient ALD while meeting today’s leading quality standards for emerging 200mm More-than-Moore markets
ALDx Enables Ultrathin, Uniform, Pinhole-Free Films at Unprecedented Speed and Efficiencies
Today’s semiconductor industry is not the same as when Atomic Layer Deposition (ALD) was first adopted. In the More-than-Moore era of today, film quality and performance are just as important as the ability to scale. As traditional and novel device architectures combine to create innovative electronics, incumbent fabrication technologies will reach their limit of quality and precision.
Things have changed, and now ALD has, too. Ultrathin, uniform and pinhole-free films by ALD are now possible at unprecedented speeds and efficiencies with Forge Nano’s ALDx equipment and solutions, bringing newfound reliability and performance to More-than-Moore device markets.
ALDx: The Solution for Reduced Wafer Cost & Limitless Film Opportunities
For semiconductor R&D and manufacturing, ALDx provides the following benefits:
- High wafer throughputs
- 12 nm/min growth rates make ALDx speeds competitive with CVD offering a superior film at viable manufacturing throughputs
- Decreased OPEX and reduced waste
- Up to 90% precursor efficiency limits process waste, decreases OPEX consumable costs and reduces the number of preventative maintenance cycles
- Low-risk manufacturing
- Single-wafer processing caps yield loss risk at one wafer and decreases the time at temperature seen by thermally sensitive devices
- No need for plasma processing (and costs!)
- Easier process integration using our catalyzed thermal process that easily enables hard-to-deposit materials at low temperature
Case Study
Featured Case Study: Optical FETs – Moisture Barrier
One of the most important layers in back-of-the-line processing for radio frequency and power devices is the encapsulation layer to protect the device from environmental degradation. While traditionally done with PECVD, ALD deposits a dense, pinhole-free film that provides superior barrier properties without risk of surface damage. Learn here how Forge Nano’s ALD-CAP® prevents the failure of optical field-effect transistors in high-stress environments with a fraction of the thickness of PECVD, and other encapsulation applications of ALD.
Who do we help?
Forge Nano provides ALD equipment and thin film solutions for fabs and foundries across the entire More-than-Moore market space. We are eager to work with companies working in the following verticals:
- Power Devices
- RF Devices
- MEMS
- CMOS Image Sensors
- LED & Photonics
- Advanced Packaging
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Metal Barrier Seed Layers
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Moisture Barriers
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High-k Dielectrics
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Passivation Layers
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Metal Contacts
ALD Equipment for Semiconductor Fabrication
Forge Nano offers two ALD coating machines for use in the semiconductor industry: THEIA and APOLLO.
THEIA
THEIA
Contact Us To Learn More
RESOURCES
Download one of our application white papers to learn more about a sub-selection of published results.
Don’t see your application? We likely have done it, contact us to talk with one of our application specialists and get the latest
