R&D Scale Wafer Coating
200mm Research Equipment
Forge Nano’s Theia system is capable of ALD processing on single wafers from 75mm to 200mm sizes. Unique or irregular substrates are easily enabled with customization available upon request.
Forge Nano’s proprietary valving and pressure control enable short ALD steps at cycles less than 3 milliseconds. The dynamic valve manifold enables an unrivaled rapid research and prototyping system. Efficient valve and pressure operation also reduce precursor waste upwards of 40x.
Al2O3, SiO2, AZO, TiO2, GaN, TiN, Bi2O3, Pt, Co, Cu, Ta2O5, Hf2O3, MLD
Copper Barrier, ALD-Cap, Optical, Adhesion/Seeding, TCOs
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