APOLLOCommercial Scale Wafer Coating

High Throughput Wafer Coating System
The APOLLO system product line sets new benchmarks in atomic layer deposition productivity and cost effectiveness. Designed for high volume semiconductor wafer-based production, our Semi-S2 certified APOLL systems integrate the high productivity of SMFD-ALD with a revolutionary simple substrate handling. The result is a flexible, modular system that can be easily configured to our customers’ needs.

performance

Performance

APOLLO provides fully automatic cassette-to-cassette ALD processes with high throughput performance at the lowest cost of ownership. APOLLO leads in every aspect of ALD productivity, performance and cost, and sets a new standard for efficiency while reducing environmental impact. With its ‘zero-waste’ processing, APOLLO lowers factory power consumption and occupies a smaller footprint on the clean-room floor.

Capabilities

  • Thick film deposition ( >1 micron)
  • Short ALD cycle times (0.4-1 sec)
  • Low temperature processing (down to 80 °C)
  • 100% conformal films over any substrate topology
  • Seamless incorporation of nano-laminates with reproducible atomic-layer control
  • Composite ternary and quaternary alloy films with no throughput penalty

Specifications

  • Temperature Window: 50 – 500 °C
  • Liquid Chemical Inlets: Up to 8
  • Gaseous Chemical Inlets: Up to 4
  • Footprint: 66″ L x 46″ W x 80″ H
  • Capacity: Up to 200mm wafers
  • Substrate Handling: Automated dual cassette

Best in Class Maintenance and Service

Chemistries:

Al2O3, SiO2, AZO, TiO2, GaN, TiN, Bi2O3, Pt, Co, Cu, Ta2O5, Hf2O3, MLD

Cost-effective, high-productivity ALD of many films and combination films including HfO2, ZrO2, Ta2O5, Al2O3, ZnO, ZnAlO, SiO2, HfSiO, TiO2, <300° TiN, BN, GaN, Nb3N5 and more.

Applications:

Copper Barrier, ALD-Cap, Optical, Adhesion/Seeding, TCOs

Design:

APOLLOTM uses our millisecond response ALD manifold that integrates our patented Fast Pneumatic Valves (FPV) to deliver over 100 million trouble-free cycles of composite and nanolaminate ALD films. This manifold is the only ALD manifold that can switch composition every cycle without any throughput penalty. Field proven, our valves set records for speed, reliability, lifetime and safety, while performing at temperatures as high as 220°C. Forge Nano’s ALD valves are the only doubly contained, spill-free UHP valves on the market.

Add Ons:

Ozone Generator, QCM, Plasma

Download our brochure for more information, or contact us to speak to a surface engineering expert.