APOLLO | Commercial Scale Wafer Coating

High Throughput Wafer Coating System

The Apollo system product line sets new benchmarks in atomic layer deposition productivity and cost effectiveness. Designed for high volume semiconductor wafer-based production, our Semi-S2 certified Apollo systems integrate the high productivity of SMFD-ALD with a revolutionary simple substrate handling. The result is a flexible, modular system that can be easily configured to our customers’ needs.

Apollo, Forge Nano's ALD tool for commercial scale semiconductor wafer coating


APOLLO provides fully automatic cassette-to-cassette ALD processes with high throughput performance at the lowest cost of ownership. APOLLO leads in every aspect of ALD productivity, performance, cost, and sets a new standard for efficiency while reducing environmental impact. With its ‘zero-waste’ processing, APOLLO lowers factory power consumption and occupies a smaller footprint on the clean-room floor.


  • Thick film deposition ( >5 micron)
  • Short ALD cycle times (0.4-1 sec)
  • Low temperature processing (down to 80 °C)
  • 100% conformal films over any substrate topology
  • Seamless incorporation of nano-laminates with reproducible atomic-layer control
  • Composite ternary and quaternary alloy films with no throughput penalty


Temperature Window: 50 – 500 °C

Liquid Chemical Inlets: Up to 8

Gaseous Chemical Inlets: Up to 4


Footprint: 66″ L x 46″ W x 80″ H

Capacity: Up to 200mm wafers

Substrate Handling: Automated dual cassette


Chemistries: Al2O3, SiO2, AZO, TiO2, GaN, TiN, Bi2O3, Pt, Co, Cu, Ta205, Hf203, MLD

Cost-effective, high-productivity ALD of many films and combination films including HfO2, ZrO2, Ta2O5, Al2O3, ZnO, ZnAlO, SiO2, HfSiO, TiO2, <300°  TiN, BN, GaN, Nb3N5 and more.

Applications: Copper Barrier, ALD-Cap, Optical, Adhesion/Seeding, TCOs

Design: APOLLO uses our millisecond response ALD manifold that integrates 10 of our patented Fast Pneumatic Valves (FPV) to deliver over 100 million trouble-free cycles of composite and nanolaminate ALD films. This manifold is the only ALD manifold that can switch composition every cycle without any throughput penalty. Field proven since 2005, our valves set records for speed, reliability, lifetime and safety, while performing at temperatures as high as 220°C.  Forge Nano’s ALD valves are the only doubly contained, spill-free UHP valves on the market.  

Add Ons: Ozone Generator, QCM, Plasma

Forge Nano's Apollo ALD tool coating a semiconductor wafer

Download our brochure for more information, or CONTACT us to speak to a surface engineering expert.


Key Features

  • High throughput per substrate
  • Low Maintenance with up time matching and exceeding legacy CVD equipment
  • Low consumables cost- up to 90% precursor utilization efficiency
  • Semi S2 and ETL certified.
  • Integrated sub-atmospheric abatement for Zero-Waste process and long pump lifetime
  • Patented long lifetime ALD valves with over 100 million trouble-free cycles
  • Integrated millisecond response ALD valves manifold for composite films deposition with no throughput penalty
  • Flexible and scalable system configuration
  • Low cost of ownership with over 75% cost savings in most applications
  • Small equipment footprint

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