Atomic Layer Deposition equipment and solutions for specialty semiconductor devices
Welcome to the intersection of film performance, wafer throughput, and chemical efficiency. Forge Nano’s ALDx technology reimagines traditional Atomic Layer Deposition, delivering high-quality, conformal films at unprecedented throughput — making ALD your first choice for thin film coating solutions.
Thermal ALD seed film enabling Cu electrodeposition on high aspect ratio through vias, > 35:1, for 3D integration
Improving PIC and microLED yield and reliability with state-of-the-art gap fill and passivation films
State of the art dielectric and passivation solutions for wide bandgap semiconductors, including SiC and GaN
Robust barrier and dielectric films for long-lasting, worry-free RFIC operation
Bespoke encapsulation, barrier and anti-stiction films for precision manufacturing of emerging sensor technology
Ability to seamlessly integrate into existing manufacturing processes. our dielectric solutions not only meet the stringent requirements of advanced technologies but also drive superior performance in high-density devices.
TEPHRA is Forge Nano’s single-wafer, thermal ALD cluster tool dedicated to high volume manufacturing of specialty semiconductor applications on 200 mm wafers and below. It is built for high throughputs, efficient chemical use and low-risk manufacturing, setting new benchmarks for thermal ALD productivity.
Atomic Armor™ is Forge Nano’s invisible performance layer that strengthens the world’s most critical systems. The proprietary platform applies ultra-thin, atomically precise coatings to materials and components, unlocking performance gains traditional methods can’t achieve. Built for industrial-scale deployment, Atomic Armor is not just a nanocoating – it’s a defensible materials technology that creates measurable competitive advantages in markets critical to national and energy security.