SEMI ALDˣ

 

Atomic Layer Deposition equipment and solutions for specialty semiconductor devices

Revolutionizing ALD

Unmatched Speed and Precision

Welcome to the intersection of film performance, wafer throughput, and chemical efficiency. Forge Nano’s ALDx technology reimagines traditional Atomic Layer Deposition, delivering high-quality, conformal films at unprecedented throughput — making ALD your first choice for thin film coating solutions.

APPLICATIONS

Metal Barrier Seed
Moisture Barriers
Passivation Layers
High – K Dielectrics

At Forge Nano, we are at the forefront of transforming multiple industries with our cutting-edge ALDx technology. Our advanced thin film coating solutions deliver unmatched speed and precision, enabling high-quality dielectric and passivation films for power devices, robust barriers for RF devices, and bespoke encapsulation for MEMS applications. We enhance the performance and reliability of photonics technologies, while our thermal ALD seed films revolutionize advanced packaging for 3D integration. By leveraging our unique turbulent flow approach, we optimize processes across various sectors, ensuring that our customers benefit from superior film performance, increased throughput, and unparalleled chemical efficiency.

Impact

Industries
We Transform

  • 01

    ADVANCED PACKAGING​

    Thermal ALD seed film enabling Cu electrodeposition on high aspect ratio through vias, > 35:1, for 3D integration

  • 02

    PHOTONICS​

    Improving PIC and microLED yield and reliability with state-of-the-art gap fill and passivation films

  • 03

    POWER DEVICES

    State of the art dielectric and passivation solutions for wide bandgap semiconductors, including SiC and GaN

  • 04

    RF DEVICES

    Robust barrier and dielectric films for long-lasting, worry-free RFIC operation

  • 05

    MEMS​

    Bespoke encapsulation, barrier and anti-stiction films for precision manufacturing of emerging sensor technology

  • 06

    High Performance Dielectric Films

    Ability to seamlessly integrate into existing manufacturing processes. our dielectric solutions not only meet the stringent requirements of advanced technologies but also drive superior performance in high-density devices.

Solutions at Every Scale

R&D Scale Wafer Coating

THEIA

Forge Nano’s Theia system is capable of ALD processing on single wafers from 75mm to 200mm sizes. Unique or irregular substrates are easily enabled with customization available upon request.

200 mm Single Module Platform

TEPHRAOne

200 mm Cluster Platform

TEHPRA

TEPHRA is Forge Nano’s single-wafer, thermal ALD cluster tool dedicated to high volume manufacturing of specialty semiconductor applications on 200 mm wafers and below. It is built for high throughputs, efficient chemical use and low-risk manufacturing, setting new benchmarks for thermal ALD productivity.

Proof In Action

Case Study

Our Impact

One of the most important layers in back-of-the-line processing for radio frequency and power devices is the encapsulation layer to protect the device from environmental degradation.

While traditionally done with PECVD, ALD deposits a dense, pinhole-free film that provides superior barrier properties without risk of surface damage.

Forge Nano Expands Semiconductor Business; Unveils new 200mm Wafer ALD Cluster Tool

Our Impact

TEPHRA is designed for specialty semiconductor applications on 200mm wafers and below. With 100x efficient chemical use, rapid cycle times, increased yield, and low-risk manufacturing, TEPHRA is the only single-wafer cluster tool with commercial throughput speeds.

The Atomic Armor™ Platform

Atomic Armor™ is Forge Nano’s invisible performance layer that strengthens the world’s most critical systems. The proprietary platform applies ultra-thin, atomically precise coatings to materials and components, unlocking performance gains traditional methods can’t achieve. Built for industrial-scale deployment, Atomic Armor is not just a nanocoating – it’s a defensible materials technology that creates measurable competitive advantages in markets critical to national and energy security.

Culture

“The collaborative environment that Forge Nano fosters makes our research enjoyable AND impactful. I love coming to work and knowing that my team is changing the world through innovation.”

Sara Harris

R&D Engineer II
“At Forge Nano we push the bounds of thin film coating technology. By designing control systems, I get to collaborate with and learn from experts in ALD every day.”

Theodore Champ

Application Engineer II
“There are always exciting projects happening. You get to see the direct impact of your efforts, and I appreciate working with such thoughtful, collaborative people.”

Brianna Boeyink

Applications Engineer
“Forge Nano is a place where bold ideas turn into real technology. I get to work on things that truly matter with people who genuinely care.”

Joel Kirner

Principal Battery Scientist
“Every project is a chance to bridge innovation and real-world application, helping turn cutting-edge ideas into tangible results that make a global impact.”

Kyle Ingham

Senior Service Engineer

Scale with Atomic Precision

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