DENVER, COLORADO — (May 2, 2013) – ALD NanoSolutions (ALDN), a nanomaterials development company using the platform Polymer ALD™ technology to develop novel barrier films, has exclusively licensed recently-developed atomic layer deposition (ALD) and molecular layer deposition (MLD) technology from the University of Colorado (Boulder).  The newly issued Japanese patent expands the ALDN proprietary IP portfolio to include ultra-thin flexible ultrabarriers created by an ALD/MLD process.  These flexible multilayer barrier solutions have been referenced in multiple FOLED market studies as being critical for the implementation of flexible OLED displays.

The newly issued patent is Japanese Patent Number 5220106 “Protective Coatings for Organic Electronic Devices Made Using Atomic Layer Deposition and Molecular Layer Deposit Techniques”.  The innovations include a unique formulation for an optically clear, flexible, water and oxygen ultrabarrier film.  Barriers will be developed onto a wide variety of polymers for compelling applications in multiple product markets. This builds on the previously issued Japanese Polymer ALDTM Patent Number 4295614 which broadly covers performing atomic layer deposition on most polymer surfaces.

About ALD NanoSolutions

ALD NanoSolutions (ALDN) is dedicated to bringing next generation performance to materials used across a wide range of industries through a portfolio of product development services, equipment offerings, and intellectual property. ALDN’s mission is to accelerate the commercial success of customers by delivering superior materials solutions based on proprietary positions around the atomic layer deposition platform. Further information on ALDN is available on the internet at