ALD TECHNOLOGY
& APPLICATIONS
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ALD TECHNOLOGY
& APPLICATIONS
Forge Nano’s scaleable ALD technology lets you unlock the power of surface engineering for a range of applications and production volumes. Our products and world-leading experts can help maximize your product potential and uncover new sources of value.
Atomic Layer Deposition (ALD) is a surface engineering technique that creates angstrom-thick, uniform, pinhole-free coatings.
ALD is a thin film application technique that uses a sequential gas phase chemical deposition process.
During this gas phase process, chemicals called precursors are introduced to the substrate to be coated. The chemical reactions caused by the precursors leave behind a one-atom thick coating. Repeating this process can build up multi-layers on nearly any surface.
High performance hermetic encapsulation
Sustained performance in harsh environments
100% conformal and pinhole free
Up to 50% increase in cycle life
Improved performance against thermal runaway
Works with existing manufacturing processes
Stabilize highly reactive metals
Triple the flowability of an amorphous material
Minimum material, maximum perfomance
Eliminate the need for refrigeration
Combined doses in a single treatment
Tune water contact angle of a surface
Sinter resistant, coke resistant
Increase desired product yield
Decrease unit size per production rate
Forge Nano has developed proprietary, scaleable ALD equipment and process expertise to deliver precision coatings across a range of product applications.
Our portfolio of equipment and services enables us to work with you from research demonstrations through commercial scale production.
Download one of our application white papers to learn more about a sub-selection of published results.
Don’t see your application? We likely have done it. Contact us to talk with one of our application specialists and get the latest.
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