Cleaner Layers.
Fewer Defects.
Better Chips.
Semiconductor ALD
Strengthening the materials behind modern compute.
Atomic Armor™ delivers nano-scale coatings with cleaner interfaces, tighter tolerances, greater durability – built for semiconductors powering AI, defense, and next-gen systems.
Impact
The Limits Holding Chips Back
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01
CONTAMINATION
Defects, contamination, and unstable interfaces limit node scaling and next-gen architectures.
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02
INSTABILITY
Unstable interfaces degrade device reliability.
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03
OVERHEATING
Thermal instability restricts AI-intensive workloads.
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04
COMPLEXITY
Complex device architectures require tighter process control.
Testimonial
“At Forge Nano we push the bounds of thin film coating technology. By designing control systems, I get to collaborate with and learn from experts in ALD every day.”
Theodore Champ
Application Engineer II
APPLICATIONS
Solving the limits of modern chips
CLEANER INTERFACES
FEWER DEFECTS
THERMAL STABILITY
HIGHER RELIABILITY
TIGHTER TOLERANCES
BETTER YIELDS
Atomic Armor™ creates a stronger foundation for modern chips, reinforcing core material layers and stabilizing advanced architectures. With more consistent behavior at the atomic scale, critical systems gain the reliability and performance headroom needed for AI intensive applications.
