Less heat.
Less leakage.
Longer hardware life
Artificial Intelligence
Atomic-scale protection for AI hardware
AI chips are held back by physics as much as algorithms. Heat, power leakage and interface defects can cap performance long before models do.
Atomic Armor™ helps reinforce the films and interfaces inside AI chips and their packaging, improving thermal stability and long-term reliability. From data center accelerators to edge devices, Atomic Armor™ helps AI hardware run faster, cooler and longer.
CHALLENGES
The Limits Holding AI Hardware Back
-
01
Heat Buildup
Dense AI chips run hot, and heat slowly breaks down the materials and interfaces inside them.
-
02
Power Leakage
As features shrink, ultra-thin films can leak current, wasting power and adding heat.
-
03
Interface Defects
Tiny flaws where materials meet can lower yields and make high-density logic less reliable.
-
04
Shorter Hardware Life
Constant high loads wear out chips and packaging faster, shortening the life of expensive hardware.
Solving the limits of AI hardware
THERMAL STABILITY
LOWER LEAKAGE
FEWER DEFECTS
PERFORMANCE PER WATT
ADVANCED PACKAGING
LONGER HARDWARE LIFE
Atomic Armor™ applies ultra-thin, uniform layers to the films and interfaces inside AI chips and their packaging. By helping stabilize thermal behavior, reduce leakage and limit defects, it is designed to support higher performance per watt, more reliable high-density logic and longer hardware life, at production scale with ALDˣ.
Built for AI-Era Chips
ALD SYSTEMS FROM R&D TO HIGH-VOLUME PRODUCTION
Forge Nano’s semiconductor systems apply ultra-thin, uniform Atomic Armor™ coatings to the films and interfaces inside advanced chips, with the throughput and efficiency high-volume fabs need.
- Throughput: Up to 10x vs. traditional ALD
- Efficiency: Up to 100x precursor utilization
- Configurations: 4-, 6- and 8-sided clusters
- Range: R&D tools to high-volume manufacturing
