LED & PHOTONICS
Improving PIC and microLED reliability with state-of-the-art gap fill and passivation films
Solving Reliability Problems for Emerging Silicon & Compound Semiconductor Photonic Devices
Emerging 3D device architectures and high aspect ratio structures in photonic integrated circuits and microLEDs demand highly conformal thin film solutions for peak performance, lifetime and reliability. Forge Nano applications for LED and photonics include:
- Sidewall passivation of microLED mesa structures
- Plasma-free gap fill for integrated photonics and waveguides
- Wafer-level encapsulation with exceptional barrier performance
RELATED APPLICATIONS
MOISTURE BARRIERS
Modular nanolaminate barriers with performance outpacing PECVD in extreme environments
PASSIVATION LAYERS
Catalyzed passivation films enabling 3D power and microLED device architectures
ATOMIC LAYER DEPOSITION EQUIPMENT
Forge Nano’s ALDx tools for both commercial and R&D applications
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