MOISTURE BARRIERS
Highly dense and defect-free, Forge Nano’s encapsulation solutions are applied at the device or wafer level, providing robust, long-lasting protection against moisture and gas ingress. Our multilayer nanolaminate design ensures reliable operation of your devices, even in extreme operating environments.
Integration
Catalyzed processes eliminate need for plasma hardware
Single-chamber depositions enable fast process switching
Increased throughput by eliminating transfer time between thermal and plasma modules
Process & Materials
Multi-oxide nanolaminates with modular designs to fit your device specifications
Up to 100x less material needed compared to thick PECVD films
Oxides Available: Al2O3, SiO2, HfO2, TiO2, ZrO2
Performance & Reliability
Water Vapor Transmission Rate (WVTR) as low as 10-10 g/m2/day
No oxygen contamination after 100 hours in HAST environments
Legacy tools running process in field for over 10 years
APPLICATION NOTE
ALD-Cap® is a flexible ceramic coating with exceptional barrier performance due to the pin-hole free and low stress nature of the atomic layer deposition (ALD) films used. ALD-CAP nanolaminates utilize alternating layers of oxide films offering better water vapor transmission rates at a fraction of the thickness compared to PECVD.
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