ABSTRACT: 

Atomic layer deposition (ALD) enables improved performance of existing device architectures and novel next-generation devices. Engineering materials on an atomic scale optimizes material characteristics such as thermostability, conductivity, and corrosion resistance. The ALD process is scalable, cost-effective, and applicable to a wide range of fields, including consumer electronics, 3D printing, lithium-ion batteries, and medical devices. Due to the self-limiting growth, ALD provides a discrete and reproducible amount of film in each cycle that is well adhered, pin-hole free, and extremely dense. Whether using a single-wafer system or multi-wafer batch system, extremely low ALD deposition rates and low-precursor efficiencies have made it difficult to transition ALD-based solutions from R&D into high volume manufacturing. This webinar presents an overview of ALD solutions currently on the market and their existing challenges. The presentation also introduces Forge Nano’s ALDx single-wafer systems which offer the fastest deposition and most efficient precursor usage on the market, enabling ALD to be integrated earlier in the product development cycle. A brief description of the differentiating features and product offerings in the ALDx toolset will be discussed.